Any STM32 in flip-chip packaging ?

[mCOZZ]

Hi everyone,

I was just wondering if there was any STM32 MCU in a flip chip packaging configuration ? I have seen some BGA packages but I came to understand that it didn't mean that the chip was flipped inside...

Any info on the matter would be appreciated thanks !

Regards,

Maxime

[Uwe Bonnes]

Hello,

the picture for

https://de.farnell.com/stmicroelectronics/stm32f091rch6/mcu-32bit-cortex-m0-48mhz-ufbga/dp/2503242?st=stm32

looks much like flipchip, and I remember I once had some flipchip device for demonstration purpose. Probably the H packages (UFBGA) are flipchip, but maybe not all. Maybe pepdending on sise Probably your FAE will know.

[Uwe Bonnes]

Compare the package drawings fore the STM32F09 UFBGA64 and UFBGA100 package. The 64 package is thinner, probably the bare chip + direct pin redistrubution + balls, while the 100 package has a thin PCB for pin redistribution.

[mCOZZ]

Thank you all for you quick answer! I will check the proposed references and post the answer as soon as I find something (may take a while though).

[mCOZZ]

While going through packaging specification I came across the WLCSP64 with this note.:

"Caution: WLCSP must be handled with care as active silicon substrate is not protected against

aggressive mechanical actions. Vacuum plastic pick-up tools are recommended for device

handling."

This seems to indicate that the silicon is facing up as needed.

Hope this can help some else too!